Wire Saw DS 264

The DS 264 cuts more wafers at markedly lower cutting costs from mono and multi-bricks. High-end design guarantees cutting with the thinnest wire.

Customers profit from easily accessible working areas and minimum changeover times. With the new DS 264 we strive for 98% yield, 95% uptime and lowest cost of ownership.

Facts and figures

• Model: DS 264
• Market Introduction: 2006
• Purpose: Thin wafer slicing
• Main benefits: Highest yield, low cutting costs, perfect accessibility, high machine utilisation

Wire Saw DS 271

25% increased loading capacity with maximum yield. With the wire saw DS 271 Meyer Burger expands its marketproven wire saw technology and meets the high demands of the solar industry. With a loading length of 1,020mm, simultaneously slicing of four bricks of 250mm length is possible. Customers benefit from increased productivity, optimised sawing processes and best quality in the field of wafer manufacturing.

Facts and figures

• Model: DS 271
• Market Introduction: 2008
• Purpose: Thin wafer slicing
• Main benefits: Plus 25% loading capacity - 1,020mm, processing of four bricks of 250mm, maximum yield, best wafer quality

Please do not hesitate to contact us for all complementary information.