New Band Saw BS 806

The new BS 806 is the ideal band saw for cutting multi-silicon jumbo ingots in the PV industry. Horizontal and vertical cutting of ingots up to sizes of 890mm x 890mm is possible.

With the newly launched band saw BS 806 Meyer Burger expands its marketproven band saw technology and meets the demands of the industry to process jumbo ingots. Customers profit from faster cutting and more productivity.

Facts and figures

• Model: BS 806
• Market Introduction 2009
• Purpose Squaring multi jumbo ingots
• Main benefits: Vertical squaring, fast cutting leads to high throughput, slabbing and squaring during same process, high uptime (min. 95 %)

Band Saw BS 830

Our improved BS 830 brings squaring and chamfering of mono-silicon ingots to the next level. Precision and increased material utilisation are the main focus of the new design. Ingots up to 2,500mm long are processed in a non-adhesive clamping operation. As a result, the tops and tails of the crystals can be recycled free of the impurities from adhesive residues. In the next process stage the crystals can be cut exactly to match the loading length of a wire saw. Customers profit from a maximum machine uptime of the wire saw as a result.

Facts and figures

• Model: BS 830
• Market Introduction 2008
• Purpose Squaring and chamfering of mono ingots
• Main benefits: Horizontal squaring and chamfering of mono-silicon ingots, processing of one ingot up to 2,500mm in one clamping movement, non-adhesive clamping, automatical centering and alignment of ingot

Please do not hesitate to contact us for all complementary information.