Meyer Burger Technology - The Expert in Photovoltaics Products

Automation For some production branches, a process can become automated to ensure a constant weld. It is possible to automate weld processes such TIG, MIG, submerged and other weld processes.
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BrickMaster BM 850 Diamond Wire The new BrickMaster is a diamond wire based solar silicon bricking unit. The BrickMaster offers market proven wire saw technology including new concepts.
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Inner Diameter Saw TS 207 The enhanced TS 207 Series 10 cuts multi c-Si bricks in the cropping process. Loading and unloading of the multisilicon ingots can be done manually or automatically.
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Media Text BrickMaster The BrickMaster BM 850 is a multi-Si bricking unit running with Diamond Wire.
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New Band Saw BS 806 The new BS 806 is the ideal band saw for cutting multi-silicon jumbo ingots in the PV industry. Horizontal and vertical cutting of ingots up to sizes of 890mm x 890mm is possible.
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Process Management System The Meyer Burger Process Management System PMS is a modular manufacturing execution system (MES). The system provides crucial business information and enables production managers to control uptime, yield and output of PV production lines.
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Wafer Measurement System The Hennecke Wafer Measurement System is modular. It combines the advantages of a wafer inspection module and a wafer sorter module.
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Wet Wafer Separation High troughput for a reduced breakage rate and a high level of reliability are features of the new separating systems from AMB.
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Wire Saw DS 264 The DS 264 cuts more wafers at markedly lower cutting costs from mono and multi-bricks. High-end design guarantees cutting with the thinnest wire.
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