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Meyer Burger Technology - The Expert in Photovoltaics

Flanked by wind and solar thermal energy, photovoltaic is THE source to give developing regions access to clean energy. In order to compete with traditional and new energy sources the photovoltaic industry follows one goal - cost reduction. The Meyer Burger Technology Group presents a whole range of systems and solutions to slash production cost in wafer manufacturing and to drive the renewable energy expansion forward.

Meyer BurgerMeyer Burger is a leading supplier of high-tech slicing and automation systems for wafer production and of measuring and handling systems for cell production. The machines, competences and technologies of the different companies in the group are used in the solar industry (photovoltaics), semi-conductor and optical industry. The thinnest wafers made from silicon, sapphire or other crystals are required in these three markets to manufacture solar modules, switching circuits or high-performance LEDs. The group's core competences are made up of a whole range of production processes, machines and systems that are used within the value chain in the manufacture of high quality wafers. The comprehensive range of products is complemented by a worldwide service network with wear and tear parts, consumables, re-grooving service, process know-how, servicing, after-sales service, training and other services. As a globally active company, the group is represented in Europe, Asia and North America in the respective key markets.

Solutions at best cost and performance for the solar industry

By pooling skills and using synergies the group puts a high level of technological expertise, process knowledge and engineering at the disposal of the solar industry. Today, Meyer Burger offers cost-effective solutions from ingot to wafer. The core competencies of the group include:

  • High-end slicing of thinnest wafers with thinnest wire
  • Slurry and diamond wire technologies
  • Automation of cost intensive processes
  • Precision wafer measurement and inspection systems
  • High-speed wafer handling and transport systems

Increased productivity with diamond wire

Today the industry's main objective is to reduce costs wherever possible and to operate as efficiently as possible. The basis of the high-performance cells is formed by super-thin cut wafers. Total Thickness Variation (TTV), topography and weight of c-Si wafers play a key role. Meyer Burger Ltd offers specialised slicing machines, which perform to micron level precision. Diamond Technologies Inc. is world's largest and oldest manufacturer of diamond wire. The process of cutting with diamond wire using water as a coolant is a "green" alternative to other cutting methods and guarantees thinnest wafers at highest accuracy and best cost-benefit ratio.

Multi-crystalline wafer manufacturing

Meyer Burger Automation GmbH has specialised in automating the very first steps of multi-crystalline wafer manufacturing. Based on its profound and wide process know-how in wafering, Meyer Burger has streamlined the pre-sawing steps and developed a fully automated process line – the BrickLine. The BrickLine combines the process steps measuring, edge and surface grinding, cropping and gluing in a closed system. Full automation not only guarantees the best possible capacity utilisation and efficiency of cost-intensive processes but also enables a constant high quality level and maximum process reliability. The key benefits of the BrickLine show in cost accounting. Thanks to fully integrated solutions the cost is reduced remarkably, and can be controlled and evaluated.

High speed separating and precision measurement systems for solar wafers

Crystalline silicon wafers become thinner in order to save material costs. The transport, separation and inspection of delicate wafers can cause a high breakage rate and result in yield losses. A gentle separation of the wafers and reliable crack detection system are essential in order to reduce costs. The group members AMB Automation and Hennecke Systems have specialised in developing high speed separating and precision measurement systems for solar wafers.

Group members

Leading slicing technologies, leading measurement technologies, wafer handling systems, robotics and automation, global customer services and diamond technologies.

Meyer Burger Technology Ltd
Group Communications
Allmendstrasse 86
CH-3600 Thun
Switzerland

mbinfo@meyerburger.ch
www.meyerburger.ch